Microstructure and Granularity Effects in Electromigration

Microstructure and Stress Aspects of Electromigration Modeling

The modifications and extensions of standard continuum models used for a description of material transport due to electromigration with models for the copper microstucture are studied. Copper grain boundaries and interfaces are modeled as a network of high diffusivity paths. Additionally, grain boundaries act as sites of vacancy recombination. The connection between mechanical stress and materi...

Effect of Microstructure on Electromigration-Induced Stress

In this paper, a finite element based simulation approach for predicting the effect of microstructure on the stresses resulting from electromigration-induced diffusion is described. The electromigration and stress-driven diffusion equation is solved coupled to the mechanical equilibrium and elastic constitutive equation, where a diffusional inelastic strain is introduced. Here, the focus is on ...

P 17 Microstructure and Stress Aspects of Electromigration Modeling

The electromigration behaviour of copper interconnects realized in damascene architecture indicates macroscopic and microscopic electromigration divergence sites. Macroscopic divergence sites exist at the cathode end of via bottoms where the barrier layer can be a blocking boundary for the electromigration flux. As microscopic divergence can be considered triple point sites of the grain boundar...

Contents 1 Copper Microstructure Impact on Evolution of Electromigration Induced

The Effect of Microstructure on Electromigration-Induced Failure Development

The effect of the microstructure on the electromigration failure development is analyzed. We investigate the influence of the statistical distribution of copper grain sizes on the electromigration time to failure distribution. Also, the effect of the microstructure on the formation and development of an electromigration-induced void is studied by simulation and the results are compared with exp...